Micron Laser Technology presents PCB Depanelizer and part excising services for consumer products, original equipment manufacturers, and pcb manufacturers. MLT’s numerous laser machining centers are geared up to deal with volumes from prototyping to long production runs. Laser depaneling or part excising can cut through metals, plastics, dielectrics, or a combination of both.
Depending on the material as well as the part requirements, MLT offers a tool-less part removal process by means of final depaneling, hold-in tabs, scoring (v-grooves), and perforations. These laser processes have the benefit of speed, positional accuracy, no tooling cost or wear, no part induced stresses, without any cutting oils or any other contaminants.
Hold-in tabs are small uncut sections concerning the part used to secure the part in the panel. The hold-in tabs can be used as easy of handling small parts or part securement for further processing. The hold-in tab width is chosen based on the level of force desired to removed the part from your panel/sheet or known forces to become applied by downstream processes like component loading or electro-polish. MLT can make tabs in most any material and also to any width and location regarding the part.
Laser scoring creates a limited depth ablation line in the part or material set. The depth is normally 50% from the material thickness but may be controlled to some desired depth. The scoring acts like the hold-tab to secure the part inside the panel or sheet, but allows for individual parts to become ‘snapped’ out. Laser scoring lines can also be used being a deliberate path for stress relief or crack propagation. Prototypes utilize scoring lines in metal to accurately bend and form parts into shape without expensive forming dies.
Comparable to scoring or v-grooves, laser perforations are another option for tool-less part removal from the panel or sheet. Perforations could be laser formed to the size and spacing to meet the required removal and Manual PCB Depanelizer. Depending on the material and also the part requirements, BEST laser services provides a tool-less part removal process in the form of final perforation, scoring and hold-in tabs. Utilizing a laser to execute the depaneling affords the user the advantage of speed and positional accuracy. Unlike mechanical methods there is not any part induced stresses, no tooling cost and no cutting oils or some other contaminants.
Laser depaneling is great for rigid-flex boards as it possesses a precise approach to cut through a variety of materials including but not confined to these most frequent materials seen:
Combinations thereof, ideal for thicknesses of rigid flex laser depanelization, rigid flex depanelizedIn addition BEST may be that provider of laser depanelization if you have plenty of IoT devices which lmuteg to be precisely machined or eliminate to match perfectly into small mechanical enclosures.
Because of the contact-free processing that goes on with laser depanelization of printed circuit boards, there is little distortion even when thin materials are employed. When boards are milled or punched out employing a mechanical tool there may prove to be a loss precision and potentially a distortion within the outside board dimensions. Even worse it could crack solder joints when utilizing these mechanical means. In BEST laser depanelization system feature fiducial registration and internet based scaling, which suggests already existing distortions can be compensated as well as the cut contours positioned precisely in the layout.
The methods for straight line PCB Laser Depaneling, that are create for rectangular-shaped PCBs, all cut or crush the advantage of the board edge. These methods include die cutting, punching or V-scoring the assembly or simply by using a wheel cutter or a saw. The sawing method typically works with a single rotating blade spinning at high RPM to reduce the panel into the shapes required. This process produces heat in the reduce area as
well as creating debris being a byproduct of the cutting operation. In V-scoring the depth in the thickness in the board is 30-40% of the original board thickness because it is cut from either side of the board. After assembly the board is broken around this v-score line. Alternately a “pizza cutter” cuts from the V-score of the panel and cuts the rest of the web up until the boards are in their final cutout shape thereby putting strain on the components and solder joints-in particular those near the board edge. In another method, the singulated board outline may be punched out form the panel. This involves that the new punch be used for every type of circuit board meaning it is far from a flexible type of method of board cut out. The punch force can also bend or deform the edges in the PCB.